A hyperelastic, thin, transparent pressure sensitive keypad(12 keys) is fabricated by embedding a silicone rubber film with conductive liquid-filled microchannels and demonstrates the use of all-compliant sensing technology.<\/p>\n\n\n\n
R. K. Kramer, C. Majidi and R. J. Wood, “Wearable tactile keypad with stretchable artificial skin,”\u00a02011 IEEE International Conference on Robotics and Automation<\/em>, Shanghai, 2011, pp. 1103-1107, doi: 10.1109\/ICRA.2011.5980082.<\/strong><\/p>\n\n\n\n A new method, embedded\u20103D printing (e\u20103DP),\u00a0is reported for fabricating strain sensors within highly conformal and extensible elastomeric matrices b extruding a viscoelastic ink through a deposition nozzle directly into an elastomeric reservoir.<\/p>\n\n\n\n Muth, Joseph T., Daniel M. Vogt, Ryan L. Truby, Yi\u011fit Meng\u00fc\u00e7, David B. Kolesky, Robert J. Wood, and Jennifer A. Lewis. “Embedded 3D printing of strain sensors within highly stretchable elastomers.”\u00a0Advanced materials<\/em>\u00a026, no. 36 (2014): 6307-6312.<\/strong><\/p>\n\n\n\n This paper discusses a platform that makes electronics both virtually unbreakable4<\/a><\/sup>\u00a0and imperceptible by fabricating directly on ultrathin (1\u2009\u03bcm) polymer foils, and the electronic circuits are light (3\u2009g\u2009m\u22122<\/sup>) and ultraflexible and conform to their ambient, dynamic environment.<\/p>\n\n\n\n Kaltenbrunner, Martin, Tsuyoshi Sekitani, Jonathan Reeder, Tomoyuki Yokota, Kazunori Kuribara, Takeyoshi Tokuhara, Michael Drack et al. “An ultra-lightweight design for imperceptible plastic electronics.”\u00a0Nature<\/em>\u00a0499, no. 7459 (2013): 458-463.<\/strong><\/p>\n","protected":false},"excerpt":{"rendered":" A hyperelastic, thin, transparent pressure sensitive keypad(12 keys) is fabricated by embedding a silicone rubber film with conductive liquid-filled microchannels and demonstrates the use of all-compliant sensing technology. R. K. Kramer, C. Majidi and R. J. Wood, “Wearable tactile keypad with stretchable artificial skin,”\u00a02011 IEEE International Conference on Robotics and Automation, Shanghai, 2011, pp. 1103-1107,
Continue reading Exercise 2<\/span> <\/a><\/p>\n","protected":false},"author":50,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[1],"tags":[],"_links":{"self":[{"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/posts\/2359"}],"collection":[{"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/users\/50"}],"replies":[{"embeddable":true,"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/comments?post=2359"}],"version-history":[{"count":1,"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/posts\/2359\/revisions"}],"predecessor-version":[{"id":2360,"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/posts\/2359\/revisions\/2360"}],"wp:attachment":[{"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/media?parent=2359"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/categories?post=2359"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/courses.ideate.cmu.edu\/16-480\/s2021\/wp-json\/wp\/v2\/tags?post=2359"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}